Toshiba: New semiconductor plant and split-up

Toshiba: New semiconductor plant and split-up

Tokyo, Feb. 5, 2022

Toshiba Corp. announced plans to invest about $870 million in a new semiconductor fab in Japan that will produce power management chips on 300-mm wafers.

The plant, which is expected to be operational by spring 2025, will more than double Toshiba’s chip production capacity. The fab will focus on chips that control electrical power in vehicles, industrial equipment and electronic devices. It will feature artificial intelligence and automated wafer transport systems, as well as an „earthquake-proof“ structure.

The update comes at a time when Toshiba is reconsidering its plan to split into three standalone companies, which it initially said would focus on devices, flash memory chips and power and infrastructure.

Now Toshiba is trying to split into two companies and sell its air-conditioning joint venture for $870 million to appease shareholders who oppose the three-way split. The new plan calls for Toshiba to spin off its power chip division and appliance business.

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